Polymer Additive Manufacturing:
Microstructure & Failure Analysis
Presented May 4, 2022
Additive manufacturing (AM) is transforming the world of plastic component production. AM has proven to be a more cost-effective solution for low production volumes, short turnaround times and complex geometries/configurations. Understanding the surface, mechanical and chemical properties of these materials should help guide part design, including material selection.
Preventing defects in 3D-printed objects is critical when designing for mechanical strength and durability. In this talk, we will describe analytical techniques used to characterize such defects. We will also present case studies that examine root cause analysis of different failure modes such as chemical attack or mechanical failure. By correlating mechanical properties with morphological analysis, we can provide insight on the microstructure of 3D-printed polymeric materials.
In this webinar, we will cover:
- Overview of polymer 3D printing methods
- Common characterization techniques
- Case studies related to raw materials and processing:
- Environmental stress-cracking
- Chemical exposure
- Wetting behavior
- Resin impurities
- Fractography of 3D printed parts
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About the Presenter:
Yanika Schneider, Ph.D., Senior Scientist and Project Manager
Yanika Schneider has over a decade of experience in polymer science and materials characterization. She received her PhD in materials chemistry from UC Santa Barbara, which was followed by a postdoctoral appointment at UC Berkeley with a focus on polymer characterization. Before joining EAG in 2013, Dr. Schneider briefly worked at an energy startup helping a nine-person team develop nanoporous carbon supercapacitors. At her current position at EAG, she specializes in the characterization of a variety of materials using infrared and x-ray fluorescence spectroscopies. She is also a project manager who oversees complex multi-technique experiments including failure analysis investigations, deformulations and quality control assessment.