How clean is my environmental chamber?
Chamber clean analysis
Environmental chambers are used to do stress testing of parts mainly for electronic devices like ICs and PCBs, adhesives, coatings, and more. The parts are often checked prior to stress and then after stress to compare performance. This is how lifetime and warranty estimates for parts are made.
Contamination from a dirty environmental test chamber can ruin your qualifications. In this webinar, we will use a case study of five environmental chambers to discuss how testing can be done to determine what materials are being deposited on samples during a stress test, and how using witness wafers and materials analytical techniques can be used to identify these deposited materials. We will also discuss what techniques are useful as well as their limitations.
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About the Presenters:
Daniel Sullivan, Ph.D., Account Executive
Dr. Daniel Sullivan has the responsibility to ensure EAG has the tools and techniques to keep up with the advances in semiconductors and electronic packaging. He has worked in and managed labs doing Failure Analysis, Reliability and Materials Analysis to help solve problems for over 34 years.
Yanika Schneider, Ph.D., Senior Scientist and Project Manager
Yanika Schneider has over a decade of experience in polymer science and materials characterization. She received her PhD in materials chemistry from UC Santa Barbara, which was followed by a postdoctoral appointment at UC Berkeley with a focus on polymer characterization. Before joining EAG in 2013, Dr. Schneider briefly worked at an energy startup helping a nine-person team develop nanoporous carbon supercapacitors. At her current position at EAG, she specializes in the characterization of a variety of materials using infrared and x-ray fluorescence spectroscopies. She is also a project manager who oversees complex multi-technique experiments including failure analysis investigations, deformulations and quality control assessment.
In this webinar we will cover:
- Issues with dirty environmental stress chambers
- Test configuration
- Complementary techniques with different depth of analysis: XPS: 5-10 nm, FTIR:1000 nm (1 µm), TOF-SIMS
- Results discussion