Electronic Device Failure Analysis

Presented: Wednesday, October 14, 2020

IR temp mapAs products and technologies become more complex, failure analysis of ICs and other components plays a critical role in the product development cycle and for improving current products. EAG has the engineering expertise coupled with a significant investment in advanced failure analysis tools and equipment to help you solve your most complex issues. We can provide the best analysis techniques and expertise to lead investigations for a wide range of samples, technology disciplines and industries.

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About the Presenters:

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Winfield Scott, Technology Director
Winfield Scott has the responsibility to ensure EAG has the tools and techniques to keep up with the advances in semiconductors and electronic packaging. He has been using FA to help solve problems for over 45 years.

 

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Vidu Weerasinghe, Senior Engineer, Failure Analysis
Vidu Weerasinghe has over a decade of hands-on failure analysis experience. He leads and performs complex root cause failure analysis investigations for a broad spectrum of technology driven industries including automotive, medical, aerospace and military.

 


In this webinar we will cover:

  • FA method
  • FA tools
  • Case studies