Electrostatic Discharge (ESD)

Presented Thursday, March 11, 2021

Damage due to electrostatic discharge (ESD) is one of the predominant failure mechanisms for integrated circuit parts. Testing susceptibility to ESD events is an essential part of the qualification process. Continually shrinking process geometries and higher speed requirements make ESD protection more challenging than ever before.

This presentation Is an overview of the ESD testing capabilities at Eurofins EAG. We describe why the tests are important and the scope of the testing available at EAG. We also give an overview of the tests and equipment set at EAG. The job submission process will be described in detail, as well as some of the pitfalls that you might face. Finally, we show how EAG can help you characterize and analyze ESD failures so that their root causes can be eliminated.



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About the Presenters:


Barry Fernelius, ESD and Latch-up Manager, Engineering Science
Barry Fernelius is responsible for two California labs, one in Santa Clara and one in Irvine. He joined EAG in 2007 as part of the Mefas acquisition. Barry has over thirty years of experience in the semiconductor industry, and he has served as a member of JC-14.1, the JEDEC committee that defines the reliability tests for packaged ICs. Barry did his graduate work at the University of Colorado in Boulder. He holds a BS in Electrical Engineering from the University of Wyoming.

In this webinar we will cover:

  • Why do we do ESD testing?
  • ESD testing scope
  • Overview of ESD tests
  • Job submission process
  • Set up pitfalls
  • What if you fail?
  • The EAG advantage
  • Case studies