Characterization and Failure Analysis of Optoelectronic Materials and Devices
Presented: Thursday, January 28, 2021
The success of modern compound semiconductor optoelectronic devices relies on the innovation and optimization of both materials engineering and device topologies. Devices such as LEDs and lasers have to handle very high power densities, often having emission areas on the order of mm^2, while only a very small portion of the overall structure, several 10’s of nms in thickness, is responsible for all the light generation. Thus, the elimination of inherent reliability issues requires an ability to characterize the structure and properties of these devices across a wide variety of length scales. This is accomplished through an integrated multi-technique approach with non-destructive testing methods for bulk characterization and defect isolation leading to further highly localized destructive techniques for root cause determination.
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About the Presenter:
Michael Salmon, Ph.D., Scientific Fellow – Advanced Imaging Group
Dr. Mike Salmon joined EAG Labs in 2007 as a Scientist. Mike earned his Ph D. degree in Materials Science and Engineering from North Carolina State University (NCSU) with an emphasis on microscopy and surface analysis. Over his career at EAG, Mike has focused on highly localized characterization and failure analysis, primarily of compound semiconductors, utilizing Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), Scanning Transmission Electron Microscopy (STEM), Electron Beam Induced Current (EBIC), and Cathodoluminescence (CL). Over his career with EAG, he has helped publish several journal articles and has given many presentations to a wide variety of industrial and academic audiences regarding materials analysis and FA of compound semiconductors.
In this webinar we will cover:
- The common tools and techniques for
- Non-destructive defect localization and bulk materials characterization
- Destructive techniques for defect analysis and root cause determination
- Real world examples of how we can utilize them for both research and development needs as well as for highly localized Failure Analysis.