Warpage and Strain Characterization using TDM®

Presented by EAG Laboratories and Insidix

Presented: Wednesday, July 8, 2020

insidix1-1During packaging and soldering process, electric components are set under thermal stress that can lead to connection issues or material degradation with huge quality impact. If specific design and material selection can reduce this risk, it is necessary to characterize this risk by analyzing the warpage and CTE while reproducing these thermal conditions.
TDM technology allows to visualize component shape (warpage) and stress (CTE) during a temperature reflow (from -65 to 400°C) and may help the engineer to select the right design and adjust their processes during assembly.

TDM is a patented range of instruments for warpage analysis under a temperature profile, it uses the fringe projection technology (also called projection moiré) for non-contact, full-field acquisition of 3D topographies with a resolution as low as 1μm.

insidix2

In this webinar, we will describe different case studies where warpage or CTE characterization could provide valuable information for process engineers or quality control engineers:

  • Case 1: characterization of BGA during soldering process
  • Case 2: strip global warp vs local unit deformation
  • Case 3: composite material characterization
  • Case 4: comparison of the quality of sockets from different suppliers

Please view all of our webinars here.


About the Presenters:

aramAram Sarkissian, General Manager, Engineering Sciences
Aram Sarkissian has held a number of leadership positions over the past 3 decades in the laboratory services space. He helped build one of the leading labs in Failure Analysis from its nascent stages to a leading position in the market and successful integration with EAG. Aram currently leads the Engineering Science division which also includes reliability, test, debug and other services geared to supporting semiconductor and microelectronics companies throughout the product development lifecycle.

pierrePierre-Louis Toussaint, Insidix Engineering Manager
Pierre-Louis Toussaint, Insidix’ engineering manager is the technical expert of TDM technology. Arrived in Insidix as application and support engineer in 2013, he has contributed to the development of latest TDM products and participated to the continuous improvement of thermal, optical and mechanical tool performances. He is located in Japan since February 2020 to accompany the electronic market development in Asia. Pierre-Louis has a mechanical engineering formation in France and has followed a master’s degree program in Japan in bio engineering.


In this webinar we will cover:

  • Overview TDM technology and applications
  • Analysis of the different case studies