Full Survey Chemical Analysis of
Plasma Resistant Ceramic Coatings

Presented: Thursday, December 10, 2020

In semiconductor and liquid crystal display (LCD) manufacturing, several processes involve plasma etch and plasma clean. The high-speed plasma stream plasma can be extremely corrosive to chambers and other surfaces that are exposed to the plasma, generating particles which frequently contaminate the substrate that is being processed, contributing to device defects. To minimize particle contamination introduced by plasma etch and/or plasma clean processes, plasma-resistant ceramic coatings have been developed and applied on various components exposed to plasma. This brings about another challenge, “how clean is the plasma resistant ceramic coating”?

M-051420_figure1

Figure 1. (a) 3D illustrations of a typical plasma resistant ceramic coating roughness;
(b) plasma atomized spots using indium mask with six sampling openings.
Darker lines around the atomized spots are indium deposits on the surface from the mask;
(c) plasma atomized crater cross-section profile.
Sampling orifice diameter ~ Ф 10 mm; average sputtering depth ~ 20 μm.

In this lecture , we will demonstrate Direct Solid Sampling GDMS as an effective tool for trace analysis of plasma-resistant ceramic coatings such as Y2O3, YF3, Y2O3/Al2O3, Y-Stabilized Zirconia, CVD-SiC, and many others. Stable sputtering can be achieved by using high purity indium as mask to initiate and maintain plasma sputtering. High matrix ion signal (up to 109 cps), can be maintained through the data acquisition, with signal intensity variation within 10% RSD, which is comparable to analysis of metal samples. Limit of detection at sub-ppm can be readily achieved for most elements in the periodic table, from Li to U. Good precision (e.g., 10-40% RSD) was demonstrated for trace analysis of a Y-stabilized zirconia reference material.

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About the Presenter:

Xinwei WangXinwei Wang, Ph.D., Project Manager
Dr. Xinwei Wang is a materials scientist and chemist with expertise on purity assay and trace elemental analysis of materials and processes involved in advanced technologies, including but not limited to high purity metals, advanced alloys, high performance ceramics, semiconductors, and pharmaceuticals that are essential for aerospace, electronics, medical, petrochemical and energy industries, etc.

Dr. Xinwei Wang joined EAG Laboratories in 2009. He started as an analyst, later became a scientist for trace analysis, with a focus on method development and validation for GDMS, ICP-OES, ICP-MS, IGA, and thermal analysis.

In this webinar we will cover:

  • Impurities in ceramic coatings
  • Demonstrate Direct Solid Sampling GDMS as an effective tool for trace analysis of plasma