SMART Chart Webinar Series: TEM
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Presented: Thursday, April 23, 2020
Let's take a deeper dive into our SMART Chart!
New technologies and industries are emerging in recent years, for example facial recognition, autonomous driving, virtual reality, 5G communication etc. For engineers, these fascinating technologies typically resonate with FinFET, VCSEL, III/V compound semiconductors; while for electron microscopists, these indicate hetero-epitaxy, cubic and hexagonal lattices, and associated failures in devices that often have complicated 3D structures. In this webinar, we will introduce the fundamental principles of Transmission Electron Microscopy (TEM) with a focus on real-world problem-solving.
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About the Presenter:
Peng Zhang, Ph.D., Senior Director of Advanced Imaging Services
Peng Zhang is a Senior Director of Advanced Imaging Services at EAG Laboratories. He received B.S. in Physics from Nanjing University in 1998, and Ph.D. in Materials Sciences from the University of California, Berkeley in 2006. At EAG, Peng is responsible for establishing new TEM applications.
In this webinar we will cover:
- Basics of TEM techniques: imaging, diffraction, EDS, and EELS
- Applications of these techniques on high-k/metal gate silicon device and III/V materials
- Brief introduction to strain analysis, GaN dislocation typing, particle analysis, and electron tomography